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CAS RN: 461-58-5 | Product Number: C0454
Dicyandiamide
Purity: >98.0%(T)
Synonyms:
- Cyanoguanidine
Product Documents:
Size | Unit Price | Shanghai | Tianjin | Japan* |
---|---|---|---|---|
25G |
¥105.00
|
4 | 23 | ≥100 |
100G |
¥150.00
|
3 | Contact Us | Contact Us |
500G |
¥180.00
|
6 | ≥60 | ≥100 |
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Product Number | C0454 |
Purity / Analysis Method | >98.0%(T) |
Molecular Formula / Molecular Weight | C__2H__4N__4 = 84.08 |
Physical State (20 deg.C) | Solid |
Storage Temperature | Room Temperature (Recommended in a cool and dark place, <15°C) |
CAS RN | 461-58-5 |
Reaxys Registry Number | 605637 |
PubChem Substance ID | 87565575 |
SDBS (AIST Spectral DB) | 2049 |
Merck Index (14) | 3092 |
MDL Number | MFCD00008066 |
Specifications
Appearance | White to Almost white powder to crystal |
Purity(Nonaqueous Titration) | min. 98.0 % |
Melting point | 209.0 to 213.0 °C |
Properties (reference)
Melting Point | 211 °C |
Maximum Absorption Wavelength | 218 nm |
Solubility in water | Slightly soluble |
Degree of solubility in water | 41.3 g/l 25 °C |
Solubility (soluble in) | Dimethylformamide |
Solubility (slightly sol. in) | Ethanol |
Solubility (insoluble in) | Chloroform, Ether, Benzene |
GHS
Related Laws:
RTECS# | ME9950000 |
Transport Information:
Customs Control Conditions (Q) |
Application
Thermal Cationic Polymerization Initiator
References
- Curing of dicyandiamide epoxy resins accelerated with substituted ureas
- The influence of composition of the dicyandiamide-asymmetric urea complex curing catalyst system on the thermal effect of the epoxy diane oligomer polymerization reaction
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