Raw Material for Polyimides that Exhibit Excellent Heat Resistance

Polyimides, with their high heat resistance and insulation properties, also play as an important role in electronic components. 2,3,6,7-NTCDA (1) is a new acid anhydride with naphthalene as the core structure. 1 can be combined with diamines to synthesize various polyimides. The acid anhydride moiety of 1 is a 5-membered ring, which has a higher reactivity, and thus it exhibits higher polymerization properties than 1,4,5,8-NTCDA, which has a 6-membered ring acid anhydride moiety.¹⁾ In addition, it is also reported that 1 is more stable toward hydrolysis than pyromellitic dianhydride. The polyimide films obtained from 1 exhibit a glass transition temperature exceeding 400 °C due to its rigid structure.^1,2) Since 1 is an electron acceptor, it is also expected to be applied to low molecular or polymeric n-type organic semiconducting materials.

References

• 1) Low-CTE Polyimides Derived from 2,3,6,7-Naphthalenetetracarboxylic Dianhydride
  • M. Hasegawa, S. Horii, Polymer J. 2007, 39, 610.
• 2) Superheat-resistant polymers with low coefficients of thermal expansion
  • M. Hasegawa, Y. Hoshino, N. Katsura, J. Ishii, Polymer 2017, 119, 91.

Related Compounds

N0369

Naphthalene-1,4,5,8-tetracarboxylic Dianhydride (= 1,4,5,8-NTCDA)

B0040

Pyromellitic Dianhydride

O0088

4,4'-Diaminodiphenyl Ether

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