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Fabrication and Evaluation of Organic Field-Effect Transistors (OFETs) : trans-DBPen
Dibenzo[a,l]pentacene
trans-DBPen
CAS RN: 227-09-8
Product Number: D5488
Performance of trans-DBPen [D5488]-based OFETs
Table. OFETs Characteristics of trans-DBPen [D5488]
Entry | Fabrication Method | Device Configuration | SAM Treatment | Tsub (°C) | Annealing Temp.a (°C) | Polarity | μ (cm2 V−1 s−1) | Vth (V) | Ion/Ioff |
---|---|---|---|---|---|---|---|---|---|
Entry1 | Fabrication MethodVacuum deposition |
Device ConfigurationTCBG | SAM Treatmentw/o Bare |
Tsub (°C)60 | Annealing Temp.a (°C)120 | Polarityp | μ (cm2 V−1 s−1)0.16 | Vth (V)‒19 | Ion/Ioff106 |
Entry2 | Fabrication MethodVacuum deposition |
Device ConfigurationTCBG | SAM TreatmentOTS | Tsub (°C)60 | Annealing Temp.a (°C)120 | Polarityp | μ (cm2 V−1 s−1)0.44 | Vth (V)‒9.8 | Ion/Ioff107 |
Entry3 | Fabrication MethodVacuum deposition |
Device ConfigurationTCBG | SAM TreatmentODTS | Tsub (°C)60 | Annealing Temp.a (°C)120 | Polarityp | μ (cm2 V−1 s−1)0.19 | Vth (V)‒6.1 | Ion/Ioff106 |

Figure. Transfer curves in the saturated region
Experimental details
Fabrication and evaluation of spin-coated trans-DBPen [D5488]-based OFETs
< Substrate>
< Self-Assembly Monolayer (SAM) Treatment>
< Vacuum Deposition>
< Post-Annealing Treatment>
< Device Configuration>
< Evaluation Condition>
< Substrate>
- Bare Si/SiO2 (thickness of SiO2: 200 nm)
- OTS-treated Si/SiO2 (thickness of SiO2: 200 nm)
- ODTS-treated Si/SiO2 (thickness of SiO2: 200 nm)
< Self-Assembly Monolayer (SAM) Treatment>
- n-Octyltrichlorosilane (OTS) [O0168]
- Piranha etching (H2SO4:H2O2=4:1, 80ºC, 2h)
- Ultrasonication (Deionized water, Acetone, IPA, 10 min each)
- Exposure to vapor (IPA, 3 min)
- UV/O3 treatment (1 h)
- Immersion in OTS solution (0.01 M toluene, 16 h, N2)
- Ultrasonication (Toluene, Acetone, IPA, 10 min each)
- n-Octyltrichlorosilane (ODTS) [T3815]
- Piranha etching (H2SO4:H2O2=4:1, 80ºC, 2h)
- Ultrasonication (Deionized water, Acetone, IPA, 10 min each)
- Exposure to vapor (IPA, 3 min)
- UV/O3 treatment (1 h)
- Immersion in ODTS solution (0.01 M toluene, 16 h, N2)
- Ultrasonication (Toluene, Acetone, IPA, 10 min each)
< Vacuum Deposition>
- Deposition rate of trans-DBPen [D5488] 0.3 Å/s (under a pressure of∼10−4 Pa)
- Substrate temperature during deposition: 60 °C
- Deposition rate of Au: 0.7 Å/s
< Post-Annealing Treatment>
- Annealing condition: 120 ºC, 5 min, N2
< Device Configuration>
- [n+-Si/SiO2 (200 nm) / trans-DBPen [D5488] (60 nm) / Au (40 nm)]
- Top-Contact Bottom-Gate Type (TCBG)
- Channel Length: 50 μm
- Channel width: 1.5 mm
< Evaluation Condition>
- Under N2
- Field-effect mobilities (μ) were determined from the transfer curves in the saturation regime using the following equation: ID = (W/2L) μ Ci (VG − Vth)2