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CAS RN: 461-58-5 | Product Number: C0454
Dicyandiamide
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Purity: >98.0%(T)
Synonyms:
- Cyanoguanidine
Product Documents:
| Size | Unit Price | Same Day | 2-3 Business Days | Other Lead Time |
Shipping Information
|
|---|---|---|---|---|---|
| 25G |
₩35,200
|
20 | ≥100 | It can be shipped in about 2 weeks after ordering | |
| 500G |
₩53,700
|
23 | ≥100 | It can be shipped in about 2 weeks after ordering |
* Please contact our distributor of SEJIN CI Co., Ltd.
if you would like to purchase TCI products. The above prices do not include freight cost, customs charge and other charges to the destination. SEJIN CI Co., Ltd. (Phone: 02-2655-2480 / email:
sales@sejinci.co.kr)
* The storage conditions are subject to change without notice.
* The storage conditions are subject to change without notice.
| Product Number | C0454 |
| Purity / Analysis Method | >98.0%(T) |
| Molecular Formula / Molecular Weight | C__2H__4N__4 = 84.08 |
| Physical State (20 deg.C) | Solid |
| Storage Temperature | Room Temperature (Recommended in a cool and dark place, <15°C) |
| CAS RN | 461-58-5 |
| Reaxys Registry Number | 605637 |
| PubChem Substance ID | 87565575 |
| SDBS (AIST Spectral DB) | 2049 |
| Merck Index (14) | 3092 |
| MDL Number | MFCD00008066 |
Specifications
| Appearance | White to Almost white powder to crystal |
| Purity(Nonaqueous Titration) | min. 98.0 % |
| Melting point | 209.0 to 213.0 °C |
Properties (reference)
| Melting Point | 211 °C |
| Maximum Absorption Wavelength | 218 nm |
| Solubility in water | Slightly soluble |
| Degree of solubility in water | 41.3 g/l 25 °C |
| Solubility (soluble in) | Dimethylformamide |
| Solubility (slightly sol. in) | Ethanol |
| Solubility (insoluble in) | Chloroform, Ether, Benzene |
GHS
Related Laws:
| RTECS# | ME9950000 |
Transport Information:
| H.S.code* | 2926.20-000 |
Application
Thermal Cationic Polymerization Initiator
References
- Curing of dicyandiamide epoxy resins accelerated with substituted ureas
- The influence of composition of the dicyandiamide-asymmetric urea complex curing catalyst system on the thermal effect of the epoxy diane oligomer polymerization reaction
PubMed Literature
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TCIMAIL
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